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Description | ![]() |
Characters: The HEP-YR02UV laser trimmers offers a new approach to trimming and fine-tuning thick-film hybrid and surface-mount devices. Equipped with a new, solid-state ultraviolet (355 nm) laser, the HEP-YR02UV utilizes a photo-ablation process to create smaller, cleaner kerfs in a variety of resistors and conductor materials. Unlike the higher frequency laser wavelengths, which remove material through heat and evaporation, HEP's UV process result in higher coupling efficiencies and greater absorption of the laser wavelength. Successful applications include thick-film,thin-film, capacitor and inductor trimming. In addition, the system can be used in a variety of micromachining applications where quality and size of cut are critical parameters. The UV-YAG diode pumped laser provides superior performance and low maintenance. Improved stability provides the user with greater production control of the trimming/machining process. For passive or active (functional) trimming, HEP-YR02UV offers high-speed measurement techniques, the ability to connect to IEEE-488 or USB-programmable measurement equipment or testers and a low noise environment. Other elements of HEP-YR02UV laser trimmers including the Industry Standard PC, built-in pattern recognition, closed-loop step and repeat parts handler, Image identify and high-speed measurement system, are the same proven sub systems that establish HEP LASER as the leading supplier of laser trimming systems in China.
Specifications:
Laser Beam Positioning Type: Temperature controlled, scanning galvanometer with closed loop servo control Trim Area: 102 mm X 102 mm Point-to-Point Move Time: Typical moves in 6 ms with software programmable Galvo Settle time Maximum Cutting Speed: 6000 mm/s Resolution: 2.5 um Repeatability: 5 um Laser Type: Diode-pumped, Q-switched Nd:YAG Wavelength: 355nm Output Power: 1.5W @10kHz Maximum Repetition Rate: 20 kHz Optics Typical Spot Size: 10~30 um (102 mm x 102 mm trim field) Depth of Focus: 0.8 mm *Actual kerf widths are material, optics and laser wavelength dependent Alignment/Viewing Alignment: Automatic substrate and multi-component alignment using machine vision Illumination: Red light emitting diode (LED) for cold light illumination Viewing: CCTV viewing optics Magnified view of trim area: Minimum Field Size (Maximum magnification): 2.5 mm x 2 mm Maximum Field Size (Minimum magnification): 10 mm x 8 mm Orientation: Image identify System Computer Type: Industry standard PC Monitor: Color LCD display Interfaces: RS232, USB, parallel, IEEE-488 and Ethernet interfaces Option: Programmable I/O card Software HepTrim Software: Menu/form driven user interface, interactive setup windows, standard trim database, standard data-logging routines and trim and test sensitivity curves for functional and passive trimming Character Generation: Menu driven, compatible with trim programs, for part numbering, serial numbering and date coding. High-level compiler-based trim language and integrated edit/compile sequence, on-line help Service Software: Menu-based, module level diagnostics and system calibration checking routines Measurement Subsystem-Resistance Type: Four terminal, force current/measure voltage Range: <1Ωto 104 MΩ(22 binary ranges) Accuracy: Integrator: +/- [0.01% range/reading + 0.05 * R (MΩ) + 10mΩ] Successive Approximation: +/- [0.1% + Integrator accuracy] Resolution: Approx.0.002% of range or with SW integration 0.0001% Conversion Speed: 35 us Calibration: Automatic Guard Offset: 1 mV Active Guard Current: Up to 100 mA Trim Comparator Resolution: 0.002% of range Measurement Subsystem-DC Voltage Type: Differential Range: 1 V to 10 V DC (5 ranges) Accuracy: Approx. 0.1% of reading Resolution: 40uV on 1V range Calibration: Automatic Maximum Input Voltage:10 V Measurement Subsystem-Matrix Type: Reed relay Configuration: Full crosspoint where any probe can be connected to any measurement line Number of Matrix Pins: Up to 64 points Measurement Options: Synchro Trim allows use of HP34410A Multimeter to perform tracking trims Remote Laser Workstation Enables remote operation of the system via the IEEE-488 or USB interface Handler Options Step and repeat parts handler with prober Type: Servo driven X-Y stages, closed loop Stepping Field: 200 mm x 200 mm X-Y Resolution: 2.5 um X-Y Accuracy: Better than 5 um over the trim area Prober: Programmable, windpipe driven, closed loop Prober Travel: Programmable up to 20 mm Prober Resolution: 3.2 um Probe Card: Industry standard 165 mm Cooler Type: Air Optional Cantilever Frame Light duty frame for customers who want simple test fixture solution Optional Custom Parts Handlers System accommodates third-party parts handlers and enclosures |
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江苏和利普激光科技有限公司
JIANGSU HEP LASER GROUP CO.,LTD.
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